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material thickness [mm]

thermal resistance R_th [K/W]

viscosity [Pa·s]

specific thermal resistance R_th

kompression_1mm30psi [% [1mm@40psi]]

volume resistance

dielectric constant

tear strength [N/mm²]

tensile strength

dielectric strength

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GEL F 50 10 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 10 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 15 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 15 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 20 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 20 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 25 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 25 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 30 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 30 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 35 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 35 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 40 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 40 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 45 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 45 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 50 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 50 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 55 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 55 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 60 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 60 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications
GEL F 50 65 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications	GEL F 50 65 density: 2.8 g/cm³ specific thermal resistance: 0.64°C cm²/W [1mm @ 30psi] temperature range: -40°C... +120°C elongation: 30 % silicone-free material, therefore no outgassing of silicone-containing ingredients ap filler function to compensate larger unevennesses and device differences very good thermal and electrical properties soft and easily compressible thermal conductive foil cuts, punched parts and special contours according to your drawing specifications

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* This information refers to the standard variant of the product, so it might change when another variant is chosen.

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